High-Performance Conductive Film Technology for Large Die Automotive Applications: MSL and Board-Level Exposed Pad Performance
![Figure 2 from Design of die-pad on exposed substrate (DOES) leadframe package for DDR3 interface applications | Semantic Scholar Figure 2 from Design of die-pad on exposed substrate (DOES) leadframe package for DDR3 interface applications | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/d3786c213abda7546f0be86addc3cda7fcddfea0/2-Figure2-1.png)
Figure 2 from Design of die-pad on exposed substrate (DOES) leadframe package for DDR3 interface applications | Semantic Scholar
![Figure 3 from Design of die-pad on exposed substrate (DOES) leadframe package for DDR3 interface applications | Semantic Scholar Figure 3 from Design of die-pad on exposed substrate (DOES) leadframe package for DDR3 interface applications | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/d3786c213abda7546f0be86addc3cda7fcddfea0/2-Figure3-1.png)
Figure 3 from Design of die-pad on exposed substrate (DOES) leadframe package for DDR3 interface applications | Semantic Scholar
![The layout and the size of the bare die pads (right) and the structure... | Download Scientific Diagram The layout and the size of the bare die pads (right) and the structure... | Download Scientific Diagram](https://www.researchgate.net/publication/328990876/figure/fig3/AS:710310063271936@1546362524374/The-layout-and-the-size-of-the-bare-die-pads-right-and-the-structure-of-the-planar.jpg)